Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11448929 | Array substrate with light shielding metal portions and manufacturing method thereof, display device | Lei Yao, Dawei Shi, Wentao Wang, Lu Yang, Haifeng Xu +8 more | 2022-09-20 |
| 11424215 | Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-08-23 |
| 11398092 | Parking detection method and device based on visual difference | Jun Yan | 2022-07-26 |
| 11362061 | Method for the electrical bonding of semiconductor components | Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf, Giovanni Capuz | 2022-06-14 |
| 11348901 | Interfacial tilt-resistant bonded assembly and methods for forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-05-31 |