Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476162 | Method for dicing a semiconductor substrate into a plurality of dies | Frank Holsteyns, Christophe Lorant, Simon Braun | 2022-10-18 |
| 11462420 | Method for packaging semiconductor dies | — | 2022-10-04 |
| 11367705 | Method for packaging semiconductor dies | — | 2022-06-21 |
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Jaber Derakhshandeh, Ingrid De Wolf, Giovanni Capuz | 2022-06-14 |
| 11316066 | Method for fabricating an optical device | Soeren Steudel, Alexander Mityashin, Maarten Rosmeulen | 2022-04-26 |