Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476162 | Method for dicing a semiconductor substrate into a plurality of dies | Frank Holsteyns, Eric Beyne, Christophe Lorant | 2022-10-18 |
| 11400659 | Sealing profile receiving device having a first and a second holding unit | Anton Sutter | 2022-08-02 |