Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476162 | Method for dicing a semiconductor substrate into a plurality of dies | Frank Holsteyns, Eric Beyne, Simon Braun | 2022-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476162 | Method for dicing a semiconductor substrate into a plurality of dies | Frank Holsteyns, Eric Beyne, Simon Braun | 2022-10-18 |