Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf | 2022-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf | 2022-06-14 |