Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527498 | Bump pad structure | Michelle Yejin Kim, Marcus HSU | 2022-12-13 |
| 11444019 | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package | Aniket PATIL, Hong Bok We | 2022-09-13 |
| 11437335 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Aniket PATIL, Bohan Yan, Dongming He | 2022-09-06 |
| 11404343 | Package comprising a substrate configured as a heat spreader | David Fraser Rae, John Holmes, Marcus HSU, Avantika Sodhi | 2022-08-02 |
| 11342254 | Multi-dielectric structure in two-layer embedded trace substrate | Joan Rey Villarba BUOT, Joonsuk Park, Karthikeyan Dhandapani | 2022-05-24 |