Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502049 | Package comprising multi-level vertically stacked redistribution portions | David Fraser Rae, Hong Bok We | 2022-11-15 |
| D965524 | Susceptor support | John DiSanto, Sam Kim, Saket Rathi | 2022-10-04 |
| D965044 | Susceptor shaft | Sam Kim, John DiSanto, Saket Rathi | 2022-09-27 |
| 11456291 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Hong Bok We, Marcus HSU | 2022-09-27 |
| 11444019 | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package | Hong Bok We, Kuiwon Kang | 2022-09-13 |
| 11437335 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Kuiwon Kang, Bohan Yan, Dongming He | 2022-09-06 |
| 11393808 | Ultra-low profile stacked RDL semiconductor package | Hong Bok We, David Fraser Rae | 2022-07-19 |
| 11342246 | Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices | Jonghae Kim, Hong Bok We | 2022-05-24 |
| 11302656 | Passive device orientation in core for improved power delivery in package | Hong Bok We, Joan Rey Villarba BUOT, Zhijie Wang | 2022-04-12 |
| D947913 | Susceptor shaft | Sam Kim | 2022-04-05 |
| 11296024 | Nested interconnect structure in concentric arrangement for improved package architecture | Hong Bok We, Jonghae Kim | 2022-04-05 |
| 11296022 | Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape | Joan Rey Villarba BUOT, Hong Bok We | 2022-04-05 |
| 11289453 | Package comprising a substrate and a high-density interconnect structure coupled to the substrate | Zhijie Wang, Hong Bok We | 2022-03-29 |