Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437335 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Kuiwon Kang, Aniket PATIL, Bohan Yan | 2022-09-06 |
| 11417622 | Flip-chip device | Yangyang SUN, John Holmes, Xuefeng Zhang | 2022-08-16 |