Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417622 | Flip-chip device | Yangyang SUN, Xuefeng Zhang, Dongming He | 2022-08-16 |
| 11404343 | Package comprising a substrate configured as a heat spreader | David Fraser Rae, Marcus HSU, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |