Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11440097 | Methods for additively manufacturing components using lattice support structures | Ryan Christopher Jones, Jun Zheng Hu, John Alan Manteiga, Earl Neal Dunham, Paul Christopher Schilling +3 more | 2022-09-13 |
| 11417622 | Flip-chip device | Yangyang SUN, John Holmes, Dongming He | 2022-08-16 |
| 11396046 | Methods for additively manufacturing components with reduced build failures caused by temperature variations | Johnnattan Tennessee Ugarte, John Eric Bloomberg, John William Moores, Justin Michael Stekli, Sameer Surendra Parasnis +1 more | 2022-07-26 |