Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527498 | Bump pad structure | Kuiwon Kang, Michelle Yejin Kim | 2022-12-13 |
| 11456291 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Hong Bok We, Aniket PATIL | 2022-09-27 |
| 11404343 | Package comprising a substrate configured as a heat spreader | David Fraser Rae, John Holmes, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |