Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342254 | Multi-dielectric structure in two-layer embedded trace substrate | Kuiwon Kang, Joonsuk Park, Karthikeyan Dhandapani | 2022-05-24 |
| 11322490 | Modular capacitor array | Zhijie Wang | 2022-05-03 |
| 11302656 | Passive device orientation in core for improved power delivery in package | Hong Bok We, Aniket PATIL, Zhijie Wang | 2022-04-12 |
| 11296022 | Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape | Aniket PATIL, Hong Bok We | 2022-04-05 |