Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454601 | Substrate evaluation chip and substrate evaluation device | Shijo Nagao, Akio Shimoyama, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi | 2022-09-27 |
| 11331759 | Solder alloy for power devices and solder joint having a high current density | Hans-Jurgen Albrecht, Klaus Wilke, Minoru Ueshima | 2022-05-17 |
| 11273525 | Bonding material, method for producing bonding material, and method for producing bonding structure | Shijo Nagao, Shih-Kang Lin | 2022-03-15 |
| 11217359 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Jinting Jiu, Minoru Ueshima, Wanli Li | 2022-01-04 |