Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11331759 | Solder alloy for power devices and solder joint having a high current density | Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima | 2022-05-17 |
| 11285569 | Soldering material based on Sn Ag and Cu | Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Müller +3 more | 2022-03-29 |