Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521946 | Method for temporarily fastening a semiconductor chip to a surface, method for producing a semiconductor component and semiconductor component | Holger Klassen, Matthias Hofmann | 2022-12-06 |
| 11285569 | Soldering material based on Sn Ag and Cu | Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen +3 more | 2022-03-29 |