Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11331759 | Solder alloy for power devices and solder joint having a high current density | Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma | 2022-05-17 |
| 11217359 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Jinting Jiu, Katsuaki Suganuma, Wanli Li | 2022-01-04 |