Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11278955 | Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor | Yoshie Tachibana | 2022-03-22 |
| 11217359 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Minoru Ueshima, Katsuaki Suganuma, Wanli Li | 2022-01-04 |