Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11278955 | Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor | Jinting Jiu | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11278955 | Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor | Jinting Jiu | 2022-03-22 |