Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11306974 | Temperature plate and heat dissipation device | Li-Kuang Tan | 2022-04-19 |
| 11273525 | Bonding material, method for producing bonding material, and method for producing bonding structure | Katsuaki Suganuma, Shijo Nagao | 2022-03-15 |