Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454601 | Substrate evaluation chip and substrate evaluation device | Katsuaki Suganuma, Akio Shimoyama, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi | 2022-09-27 |
| 11273525 | Bonding material, method for producing bonding material, and method for producing bonding structure | Katsuaki Suganuma, Shih-Kang Lin | 2022-03-15 |