Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Soichi Sakamoto, Katsumi Miyawaki, Hiroaki Ichinohe | 2022-12-27 |
| 11424178 | Semiconductor module | Satoshi Kondo, Hidetoshi Ishibashi, Hiroshi Yoshida, Nobuhiro Asaji, Yusuke ISHIYAMA +1 more | 2022-08-23 |
| 11398447 | Semiconductor device and method for producing semiconductor device | Shohei Ogawa, Satoru Ishikawa, Takumi Shigemoto, Yusuke ISHIYAMA | 2022-07-26 |
| 11239123 | Semiconductor module, semiconductor device, and vehicle | Tatsuya Kawase, Noboru Miyamoto, Mikio Ishihara, Yuji IMOTO, Naoki Yoshimatsu | 2022-02-01 |