Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Junji Fujino, Katsumi Miyawaki, Hiroaki Ichinohe | 2022-12-27 |