Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Junji Fujino, Soichi Sakamoto, Hiroaki Ichinohe | 2022-12-27 |
| 11508646 | Semiconductor device | — | 2022-11-22 |
| 11315842 | Semiconductor package | Hiromitsu Utsumi, Hiroaki Minamide, Suguru Maki | 2022-04-26 |
| 11309231 | Semiconductor device | Hiroaki Ichinohe, Takao Moriwaki | 2022-04-19 |