Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Junji Fujino, Soichi Sakamoto, Katsumi Miyawaki | 2022-12-27 |
| 11393778 | Semiconductor device and antenna device | Akihiro Matsusue | 2022-07-19 |
| 11335619 | Semiconductor device | — | 2022-05-17 |
| 11309231 | Semiconductor device | Katsumi Miyawaki, Takao Moriwaki | 2022-04-19 |