Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450592 | Semiconductor package with a plurality of chips having a groove in the encapsulation | Hiroya SANNAI, Kei Hayashi, Yosuke NAKATA, Yuji IMOTO | 2022-09-20 |
| 11239123 | Semiconductor module, semiconductor device, and vehicle | Noboru Miyamoto, Mikio Ishihara, Junji Fujino, Yuji IMOTO, Naoki Yoshimatsu | 2022-02-01 |