Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508698 | Semiconductor package and semiconductor device | — | 2022-11-22 |
| 11462516 | Method of manufacturing semiconductor device | — | 2022-10-04 |
| 11450592 | Semiconductor package with a plurality of chips having a groove in the encapsulation | Hiroya SANNAI, Kei Hayashi, Tatsuya Kawase, Yuji IMOTO | 2022-09-20 |
| 11430726 | Semiconductor module | — | 2022-08-30 |
| 11387158 | Semiconductor device and semiconductor element | — | 2022-07-12 |
| 11302538 | Semiconductor device manufacturing method | — | 2022-04-12 |
| 11264245 | Method for manufacturing semiconductor device | Shinya SONEDA, Kenji Harada | 2022-03-01 |
| 11251098 | Semiconductor device, production method therefor, and automobile | — | 2022-02-15 |