Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450592 | Semiconductor package with a plurality of chips having a groove in the encapsulation | Hiroya SANNAI, Yosuke NAKATA, Tatsuya Kawase, Yuji IMOTO | 2022-09-20 |
| 11424398 | Thermoelectric conversion material and thermoelectric conversion module | Yosuke Kurosaki, Shin YABUUCHI, Jun Hayakawa, Yuzuru Miyazaki, Tomohisa Takamatsu | 2022-08-23 |