Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450592 | Semiconductor package with a plurality of chips having a groove in the encapsulation | Kei Hayashi, Yosuke NAKATA, Tatsuya Kawase, Yuji IMOTO | 2022-09-20 |
HS
Hiroya SANNAI
Overall (2022): #431,935 of 548,613Top 80%
1
Patents 2022