Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488924 | Semiconductor element bonding substrate, semiconductor device, and power conversion device | — | 2022-11-01 |
| 11398447 | Semiconductor device and method for producing semiconductor device | Shohei Ogawa, Junji Fujino, Takumi Shigemoto, Yusuke ISHIYAMA | 2022-07-26 |