Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527620 | Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material | Kamal M. Karda, Deepak Chandra Pandey, Haitao Liu, Guangyu Huang, Yunfei Gao +2 more | 2022-12-13 |
| 11527550 | Memory array and a method used in forming a memory array | Changhan Kim, John D. Hopkins, Collin Howder | 2022-12-13 |
| 11514953 | Integrated assemblies, and methods of forming integrated assemblies | Yoshiaki Fukuzumi, Paolo Tessariol, David H. Wells, Lars Heineck, Lifang Xu +2 more | 2022-11-29 |
| 11456208 | Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems | Sidhartha Gupta, David Ross Economy, Kyle A. Ritter, Naveen Kaushik | 2022-09-27 |
| 11404440 | Memory arrays | Sanh D. Tang, Yi Fang Lee, Martin C. Roberts | 2022-08-02 |
| 11393920 | Integrated assemblies and methods of forming integrated assemblies | David K. Hwang, John F. Kaeding, Scott E. Sills | 2022-07-19 |
| 11322516 | Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems | Matthew J. King, David Daycock, Yoshiaki Fukuzumi, Albert Fayrushin, Chandra S. Tiwari +1 more | 2022-05-03 |
| 11302708 | Memory arrays, and methods of forming memory arrays | Changhan Kim, Chet E. Carter, Cole Smith, Collin Howder, Jie Li | 2022-04-12 |
| 11302628 | Integrated assemblies having conductive-shield-structures between linear-conductive-structures | Naveen Kaushik, Yoshihiko Kamata, Kyle A. Ritter, Tomoko Ogura Iwasaki, Haitao Liu | 2022-04-12 |
| 11289501 | Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies | Shyam Surthi, Byeung Chul Kim, Francois H. Fabreguette, Gurtej S. Sandhu | 2022-03-29 |
| 11244954 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Shyam Surthi, Davide Resnati, Paolo Tessariol, John D. Hopkins | 2022-02-08 |
| 11227861 | Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array | Hiroki Fujisawa, Charles L. Ingalls, Gurtej S. Sandhu, Scott J. Derner | 2022-01-18 |