Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11514987 | Erasing memory | Giovanni Maria Paolucci, Emilio Camerlenghi, Gianpietro Carnevale, Augusto Benvenuti | 2022-11-29 |
| 11514953 | Integrated assemblies, and methods of forming integrated assemblies | Yoshiaki Fukuzumi, David H. Wells, Lars Heineck, Richard J. Hill, Lifang Xu +2 more | 2022-11-29 |
| 11489038 | Capacitors having vertical contacts extending through conductive tiers | Qiang Tang | 2022-11-01 |
| 11430734 | Methods of forming memory devices including stair step structures | Graham R. Wolstenholme, Aaron Yip | 2022-08-30 |
| 11424267 | Dielectric extensions in stacked memory arrays | Yoshiaki Fukuzumi | 2022-08-23 |
| 11417676 | Methods of forming microelectronic devices and memory devices, and related microelectronic devices, memory devices, and electronic systems | Umberto Maria Meotto, Emilio Camerlenghi, Luca Laurin | 2022-08-16 |
| 11329062 | Memory arrays and methods used in forming a memory array | Justin B. Dorhout, Erik Byers, Merri L. Carlson, Indra V. Chary, Damir Fazil +6 more | 2022-05-10 |
| 11302634 | Microelectronic devices with symmetrically distributed staircase stadiums and related systems and methods | Lifang Xu, Jian Li, Graham R. Wolstenholme, George Matamis, Nancy M. Lomeli | 2022-04-12 |
| 11282815 | Methods of forming microelectronic devices, and related microelectronic devices and electronic systems | Kunal R. Parekh, Akira Goda | 2022-03-22 |
| 11271002 | Methods used in forming a memory array comprising strings of memory cells | M. Jared Barclay, Merri L. Carlson, Saurabh Keshav, George Matamis, Young-joon Moon +2 more | 2022-03-08 |
| 11244954 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Shyam Surthi, Davide Resnati, Richard J. Hill, John D. Hopkins | 2022-02-08 |
| 11244955 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Justin B. Dorhout, Jian Li, Ryan Meyer | 2022-02-08 |