Issued Patents 2022
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538822 | Integrated assemblies having metal-containing liners along bottoms of trenches, and methods of forming integrated assemblies | Justin D. Shepherdson, Collin Howder, Jordan D. Greenlee | 2022-12-27 |
| 11532638 | Memory device including multiple decks of memory cells and pillars extending through the decks | Darwin A. Clampitt, Shawn D. Lyonsmith, Matthew J. King, Lisa M. Clampitt, Kevin Y. Titus +5 more | 2022-12-20 |
| 11527550 | Memory array and a method used in forming a memory array | Changhan Kim, Richard J. Hill, Collin Howder | 2022-12-13 |
| 11515320 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Jordan D. Greenlee, Nancy M. Lomeli | 2022-11-29 |
| 11495617 | Electronic devices and systems with channel openings or pillars extending through a tier stack, and methods of formation | Nancy M. Lomeli, Justin B. Dorhout, Damir Fazil | 2022-11-08 |
| 11482534 | Integrated structures and methods of forming vertically-stacked memory cells | Fatma Arzum Simsek-Ege, Meng-Wei Kuo | 2022-10-25 |
| 11476274 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, Jordan D. Greenlee, Yongjun Jeff Hu | 2022-10-18 |
| 11476332 | Integrated assemblies, and methods of forming integrated assemblies | Jordan D. Greenlee | 2022-10-18 |
| 11469249 | Method of fabricating electronic devices comprising removing sacrificial structures to form a cavity | Darwin A. Clampitt, David H. Wells, Kevin Y. Titus | 2022-10-11 |
| 11450601 | Assemblies comprising memory cells and select gates | George Matamis | 2022-09-20 |
| 11417682 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Shyam Surthi, Jordan D. Greenlee | 2022-08-16 |
| 11411012 | Methods used in forming a memory array comprising strings of memory cells | — | 2022-08-09 |
| 11411085 | Devices comprising floating gate materials, tier control gates, charge blocking materials, and channel materials | — | 2022-08-09 |
| 11411021 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee | 2022-08-09 |
| 11404436 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Jordan D. Greenlee | 2022-08-02 |
| 11398427 | Integrated assemblies and methods of forming integrated assemblies | Alyssa N. Scarbrough | 2022-07-26 |
| 11398486 | Microelectronic devices with tier stacks with varied tier thicknesses, and related methods and systems | Nancy M. Lomeli | 2022-07-26 |
| 11393672 | Methods of forming microelectronic devices including an interdeck region between deck structures | Damir Fazil | 2022-07-19 |
| 11393835 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Nancy M. Lomeli | 2022-07-19 |
| 11393756 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Jordan D. Greenlee, Christian George Emor, Luca Fumagalli, Rita J. Klein, Christopher W. Petz +1 more | 2022-07-19 |
| 11387243 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Nancy M. Lomeli | 2022-07-12 |
| 11329062 | Memory arrays and methods used in forming a memory array | Justin B. Dorhout, Erik Byers, Merri L. Carlson, Indra V. Chary, Damir Fazil +6 more | 2022-05-10 |
| 11315877 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer, Lifang Xu, Daniel Billingsley +1 more | 2022-04-26 |
| 11315941 | Memory having a continuous channel | Luan C. Tran, Hongbin Zhu, Yushi Hu | 2022-04-26 |
| 11302710 | Foundational supports within integrated assemblies | Darwin A. Clampitt, Matthew J. King, M. Jared Barclay | 2022-04-12 |