Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538822 | Integrated assemblies having metal-containing liners along bottoms of trenches, and methods of forming integrated assemblies | John D. Hopkins, Justin D. Shepherdson, Collin Howder | 2022-12-27 |
| 11527546 | Microelectronic devices including conductive structures, and related memory devices, electronic systems, and methods | Daniel Billingsley, Matthew J. King, Yongjun Jeff Hu, Tom George, Amritesh Rai +2 more | 2022-12-13 |
| 11515320 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | John D. Hopkins, Nancy M. Lomeli | 2022-11-29 |
| 11476332 | Integrated assemblies, and methods of forming integrated assemblies | John D. Hopkins | 2022-10-18 |
| 11476274 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, John D. Hopkins, Yongjun Jeff Hu | 2022-10-18 |
| 11417682 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Shyam Surthi | 2022-08-16 |
| 11411021 | Integrated assemblies and methods of forming integrated assemblies | John D. Hopkins | 2022-08-09 |
| 11404436 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2022-08-02 |
| 11393756 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Christian George Emor, Luca Fumagalli, John D. Hopkins, Rita J. Klein, Christopher W. Petz +1 more | 2022-07-19 |
| 11355392 | Conductive via of integrated circuitry, memory array comprising strings of memory cells, method of forming a conductive via of integrated circuitry, and method of forming a memory array comprising strings of memory cells | Yiping Wang, Collin Howder | 2022-06-07 |
| 11342265 | Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems | Lifang Xu, Rita J. Klein, Xiao Li, Everett A. McTeer | 2022-05-24 |
| 11315877 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | John D. Hopkins, Rita J. Klein, Everett A. McTeer, Lifang Xu, Daniel Billingsley +1 more | 2022-04-26 |
| 11302707 | Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies | John D. Hopkins | 2022-04-12 |
| 11244903 | Tungsten structures and methods of forming the structures | Christian George Emor, Travis Rampton, Everett A. McTeer, Rita J. Klein | 2022-02-08 |