| 11538809 |
Metal insulator semiconductor (MIS) contact in three dimensional (3D) vertical memory |
Kamal M. Karda, Litao Yang, Srinivas Pulugurtha, Yunfei Gao, Haitao Liu |
2022-12-27 |
| 11527620 |
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material |
Kamal M. Karda, Haitao Liu, Richard J. Hill, Guangyu Huang, Yunfei Gao +2 more |
2022-12-13 |
| 11515311 |
Semiconductor structure formation at differential depths |
Venkata Naveen Kumar Neelapala, Naveen Kaushik |
2022-11-29 |
| 11430793 |
Microelectronic devices including passing word line structures, and related electronic systems and methods |
Venkata Naveen Kumar Neelapala, Haitao Liu |
2022-08-30 |
| 11393928 |
Access devices formed with conductive contacts |
Haitao Liu, Yunfei Gao, Kamal M. Karda, Sanh D. Tang, Litao Yang |
2022-07-19 |
| 11373913 |
Method of forming an array of vertical transistors |
Haitao Liu, Kamal M. Karda |
2022-06-28 |
| 11362018 |
Low capacitance through substrate via structures |
Haitao Liu, Chandra Mouli |
2022-06-14 |
| 11348932 |
Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies |
Kamal M. Karda, Haitao Liu, Durai Vishak Nirmal Ramaswamy, Yunfei Gao, Sanh D. Tang |
2022-05-31 |
