Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502053 | Bond pad connection layout | Bharat Bhushan, Pratap Murali, Raj K. Bansal | 2022-11-15 |
| 11417681 | Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias | Yi Hu, Merri L. Carlson, Anilkumar Chandolu, Indra V. Chary, Harsh Narendrakumar Jain +5 more | 2022-08-16 |
| 11355607 | Semiconductor device structures with liners | Christopher J. Larsen, Kunal Shrotri | 2022-06-07 |
| 11322516 | Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems | Matthew J. King, Yoshiaki Fukuzumi, Albert Fayrushin, Richard J. Hill, Chandra S. Tiwari +1 more | 2022-05-03 |