Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502053 | Bond pad connection layout | Bharat Bhushan, Pratap Murali, David Daycock | 2022-11-15 |
| 11456253 | Semiconductor device and method of forming the same | Shigeru Sugioka, Hidenori Yamaguchi, Noriaki Fujiki, Keizo Kawakita | 2022-09-27 |
| 11450645 | Semiconductor assemblies with hybrid fanouts and associated methods and systems | Bharat Bhushan, Pratap Murali | 2022-09-20 |