Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502053 | Bond pad connection layout | Pratap Murali, Raj K. Bansal, David Daycock | 2022-11-15 |
| 11450645 | Semiconductor assemblies with hybrid fanouts and associated methods and systems | Pratap Murali, Raj K. Bansal | 2022-09-20 |
| 11438801 | Traffic separation in a controller based multi-AP network | Xiaolong Huang, Brian Michael Buesker, Sai Yiu Duncan Ho | 2022-09-06 |
| 11310690 | Traffic service prioritization in a controller based multi-AP network | Xiaolong Huang, Brian Michael Buesker, Sai Yiu Duncan Ho | 2022-04-19 |
| 11248129 | Liquid impregnated surfaces for liquid repellancy | Philip Simon Brown | 2022-02-15 |