Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476268 | Methods of forming electronic devices using materials removable at different temperatures | Chandra S. Tiwari | 2022-10-18 |
| 11411013 | Microelectronic devices including stair step structures, and related electronic devices and methods | Jivaan Kishore Jhothiraman, Matthew J. King | 2022-08-09 |
| 11355607 | Semiconductor device structures with liners | Christopher J. Larsen, David Daycock | 2022-06-07 |
| 11329064 | Integrated assemblies and methods of forming integrated assemblies | Ramey M. Abdelrahaman, Jeslin J. Wu, Chandra S. Tiwari, Swapnil Lengade | 2022-05-10 |
| 11296103 | Integrated assemblies and methods of forming integrated assemblies | Shyam Surthi, Matthew Thorum | 2022-04-05 |
| 11239252 | Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus | Justin B. Dorhout, Fei Wang, Chet E. Carter, Ian C. Laboriante, John D. Hopkins +5 more | 2022-02-01 |