Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2022-12-13 |
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2022-06-21 |
| 11309281 | Overlapping die stacks for NAND package architecture | Enyong Tai, Hem Takiar, Li-Ping Wang | 2022-04-19 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2022-03-22 |