Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2022-12-13 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2022-03-22 |