Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2022-12-13 |
| 11309281 | Overlapping die stacks for NAND package architecture | Enyong Tai, Li-Ping Wang, Hong Wan Ng | 2022-04-19 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2022-03-22 |