Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2022-12-13 |
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, David J. Corisis | 2022-06-21 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2022-03-22 |
| 11239128 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Choon Kuan Lee, Wang Lai Lee, Roslan Bin Said | 2022-02-01 |