Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2022-06-21 |
| 11239128 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2022-02-01 |