Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309281 | Overlapping die stacks for NAND package architecture | Hem Takiar, Li-Ping Wang, Hong Wan Ng | 2022-04-19 |
ET
Enyong Tai
Overall (2022): #463,649 of 548,613Top 85%
1
Patents 2022