Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508678 | Semiconductor package structure including antenna | Yen-Yao Chi, Nai-Wei Liu | 2022-11-22 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu | 2022-09-20 |
| 11410936 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2022-08-09 |
| 11387176 | Semiconductor package structure | Yuan Liu | 2022-07-12 |
| 11362044 | Semiconductor package structure | Yung-Chang Lien | 2022-06-14 |
| 11348900 | Package structure | Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang | 2022-05-31 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2022-03-01 |