Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495566 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroyuki Iwamoto, Daisuke Souma | 2022-11-08 |
| 11478869 | Method for forming bump electrode substrate | Takahiro Hattori, Hiroki Sudo, Daisuke Souma | 2022-10-25 |
| 11358514 | Mobile object and storage medium | Yoichiro Sako, Kazuhiro Watanabe, Kazuyuki Sakoda, Hirofumi Yuchi, Kohei Asada | 2022-06-14 |
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Daisuke Soma, Takashi Akagawa +4 more | 2022-05-31 |