Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478869 | Method for forming bump electrode substrate | Takahiro Hattori, Hiroshi Okada, Daisuke Souma | 2022-10-25 |
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa +4 more | 2022-05-31 |