Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495566 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada | 2022-11-08 |
| 11478869 | Method for forming bump electrode substrate | Takahiro Hattori, Hiroki Sudo, Hiroshi Okada | 2022-10-25 |