Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495566 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada, Daisuke Souma | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495566 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada, Daisuke Souma | 2022-11-08 |