Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495566 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Hiroyuki Iwamoto, Hiroshi Okada, Daisuke Souma | 2022-11-08 |
| 11438469 | Wireless terminal, management server and intention interpretation server | — | 2022-09-06 |
| 11340849 | Information processing apparatus, information processing method, and storage medium, that include a wireless connection request blocking feature | — | 2022-05-24 |